ON THIS PAGE YOU WILL FIND,CPU DEFINED,PACKAGES OF, SOCKETS AND SLOTS OF,AND TYPES OF.

------------CPU------------

CENTRAL PROCESSING UNIT /PROCESSOR

PERFORMS ALL OF THE ARITHMETIC,LOGIC,AND COMPUTING ACTIONS
OF A PC.IT IS A INTEGRATED CIRCUIT THAT CONTAINS MILLIONS OF
TRANSISTORS INTERCONNECTED BE SMALL ALUMINUM WIRES.ITS
PROCESSING CAPABILITIES CONTROL AND DIRECT THE ACTIVITIES OF
THE PC BE INTERACTING WITH THE OTHER ELECTRONIC COMPONENTS
ON THE MOTHERBOARD,SUCH AS THE MAIN MEMORY,BUS STRUCTURES,
CACHE MEMORY,AND DEVICE INTERFACES.

CPU PACKAGING:

*DIPP = DUAL INLINE PIN PACKAGE

(OBSOLETE)8088,8086,80286
DIPP`S WERE THE FIRST GENERATION OF PACKAGING FOR
MICROPROCESSORS.THEY WERE DISTINCT,WITH TWO ROWS OF
PINS ON EITHER SIDE OF THE PROCESSOR.

*PGA = PIN GRID ARRAY

80286,80386,486
WERE VERY POPULAR FOR DESKTOP MACHINES,AS THEIR
RELATIVE SIZE ALLOWED FOR EASY HEAT DISSIPATION.THE
MOUNTING PINS ARE LOCATED ON THE BOTTOM OF THE CHIP IN
CONCENTRIC SQUARES.THE PENTIUM III FEATURES A VARIATION
OF THE PGA PACKAGE WITH ITS SLOT 370-LIKE FLIP CHIP-PIN
GRAPHICS ASSEMBLY ( FC-PGA )

SPGA = STAGGERED PIN GRID ARRAY

PENTIUM,PENTIUM PRO,K 5,K7 6X86,CELERON.SPGA`S HAVE SOME OR ALL OF THEIR PINS ORGANIZED IN A DIAGONAL PATTERN.THIS ALLOWS
THE CPU TO HAVE MORE CLOSELY PACKED PINS,THEREBY KEEPING THE
OVER ALL PACKAGE SMALLER.LIKE PGA,SPGA CPU`S ALSO HAVE SPECIAL
ZIF SOCKETS, ( ZERO-INSERTION FORCE )

*PBGA = PLASTIC BALL GRID ARRAY

THE PRIMARY DIFFERENCE BETWEEN THIS PACKAGING TECHNOLOGY AND THE PGA IS THAT THE PBGA DOES`T HAVE MOUNTING PINS PROJECTING FROM THE BOTTOM OF THE CHIP,WHICH ELIMATES THE THREAT OF BENT PINS ON THE BOTTOM OF THE PROCESSOR.OTHERWISE,THESE PACKAGE
STYLES LOOK SIMILAR.

*SEC SINGLE EDGE CONNECTOR

A PACKAGING STYLE THAT IS MOUNTED PERPENDICULAR TO THE MOTHERBOARD INTO A SINGLE SLOT,MUCH LIKE EXPANSION CARDS AND MEMORY MODULES.PENTIUM II WAS THE FIRST PROCESSOR WITH THIS STYLE.

MOUNTING CPU`S TO MOTHERBOARDS
(SOCKETS AND SLOTS)

SLOT 1 : TECHNICALLY CALLED SC-242

242 PINS.IT IS PROPRIETARY INTEL CONNECTOR USED FOR CELERON,
PENTIUM II,AND PENTIUM III

SLOT 2 : TECHNICALLY CALLED THE SC-330 CONNECTOR.

INTEL MOUNTING FOR ITS PENTIUM II XEON AND PENTIUM III XEON
CHIPS.ENHANCES THE ABILITY OF MULTIPLE PROCESSORS
INSTALLED IN THE SAME PC TO WORK TOGETHER.

SLOT A :

AMD ATHLON PROCESSOR USE THIS SLOT STYLE,WHICH IS PHYSICALLY THE SAME AS A SLOT 1 CONNECTOR.HOWEVER,IT USES DIFFERENT PIN
ASSIGNMENTS,MAKING IT UNUSABLE BY INTEL PROCESSOR.

SLOT M :

DESIGNED TO HOLD THE 64-BIT INTEL ITANIUM PROCESSOR.

SOCKET 4 :

MOUNTS THE 273-PIN PGA PACKAGE OF THE PENTIUM 60 AND
PENTIUM 66 PROCESSOR.

SOCKET 5 :

MOUNTS THE 320-PIN STAGGERED PIN GRID ARRAY OF EARLY
3V PENTIUM PROCESSORS.

SOCKET 7 :

MOUNTS THE 321-PIN SPGA OF THE LATER RELEASE PENTIUM PROCESSORS AND THE CHIPS OF AMD,CYRIX,AND IDT.

SUPER 7 SOCKETS:

AN EXTENSION OF THE SOCKET 7 DESIGN USED FOR THE
AMD K 6 PROCESSOR.

SOCKET 370 :

DESIGNED FOR THE CELERON PROCESSOR IN A PLASTIC PIN GRID ARRAY PACKAGING.NAME IS FROM THE NUMBER OF PINS IT SUPPORTS.

--------------TYPES OF PROCESSORS-----------------

PENTIUM :

32-BIT MULTITASKING AND EXPANDED THE
INTERNAL BUS TO 64-BITS AND HIGH-SPEED INTERNAL CACHE.

PENTIUM PRO :

DESIGNED FOR 32-BIT NETWORK OPERATING SYSTEMS.CONFIGURING
ONE,TWO,OR FOUR CPU`S.ALSO WITH A 1 MEGABIT OF ADVANCED
2ND LEVEL CACHE,( L2 ).

PENTIUM II :

PENTIUM PRO WITH MMX TECHNOLOGY.USED IN MULTIMEDIA
WHEN FULL-MOTION VIDEO AND 3D IMAGES ARE NEEDED.

PENTIUM III:

9.5 MILLION TRANSISTORS,32K L1 CACHE,512K
OF LEVEL 2 CACHE,WITH CLOCK SPEEDS OF 450MHz TO 1 GHz.

XEON :

CPU USED IN NETWORK SERVER`S,CAN SUPPORT 4 TO 8 CPU`S.
AS WELL AS ADDRESSING AND CACHING 64 GB OF MEMORY.

AMD :

ADVANCED MICRO DEVICES
INTEL`S MAIN COMPETITOR,KNOWN BEST FOR THEIR HIGH LEVELS OF L2 CACHE,SPEED,AND PRICE.CPU`S INCLUDE ATHLON,DURON,K6`S.

CYRIX :

KNOWN FOR PRODUCING LOW POWER AND LOW
TEMPERATURE PROCESSOR`S.WITH THEIR MMX INSTRUCTION
SET.THEY ARE CONSIDERED EGUAL TO PENTIUM II CELERON.

CELERON :

LOW COST CPU,USED IN DESKTOP`S AND PORTABLE COMPUTERS.